DocumentCode
3092886
Title
Practical quantitative solderability testing
Author
DeVore, John A.
Author_Institution
General Electric Co., Syracuse, NY, USA
fYear
1989
fDate
22-26 May 1989
Firstpage
2027
Abstract
Quantitative solderability testing is explored in all its aspects. The methods are discussed as well as the standardization problems and the limited usage in the electronics industry. The latest wetting balance test methods are discussed in detail. A practical, easy-to-use system is examined which can combine any wetting balance with an off-the-shelf computer to enhance the use of quantitative solderability testing in the incoming inspection environment. The resulting program utilizes an advanced interpretation technique which culminates in a single solderability number. This solderability number reflects all the known solderability mechanisms, allowing consistent decisions to be made about the overall solderability of a lead. The output of the system is data on buoyancy-correlated wetting time, wetting force at 2 s, the maximum withdrawal force minus the maximum wetting force (the delta kick force), and the calculated solderability number
Keywords
electronic equipment testing; inspection; soldering; buoyancy-correlated wetting time; delta kick force; electronics industry; incoming inspection; maximum withdrawal force; quantitative solderability testing; solderability number; standardization problems; wetting balance test methods; History; Inorganic materials; Inspection; Instruments; Lead; Materials testing; Performance evaluation; Time measurement; Wire; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National
Conference_Location
Dayton, OH
Type
conf
DOI
10.1109/NAECON.1989.40499
Filename
40499
Link To Document