• DocumentCode
    3092886
  • Title

    Practical quantitative solderability testing

  • Author

    DeVore, John A.

  • Author_Institution
    General Electric Co., Syracuse, NY, USA
  • fYear
    1989
  • fDate
    22-26 May 1989
  • Firstpage
    2027
  • Abstract
    Quantitative solderability testing is explored in all its aspects. The methods are discussed as well as the standardization problems and the limited usage in the electronics industry. The latest wetting balance test methods are discussed in detail. A practical, easy-to-use system is examined which can combine any wetting balance with an off-the-shelf computer to enhance the use of quantitative solderability testing in the incoming inspection environment. The resulting program utilizes an advanced interpretation technique which culminates in a single solderability number. This solderability number reflects all the known solderability mechanisms, allowing consistent decisions to be made about the overall solderability of a lead. The output of the system is data on buoyancy-correlated wetting time, wetting force at 2 s, the maximum withdrawal force minus the maximum wetting force (the delta kick force), and the calculated solderability number
  • Keywords
    electronic equipment testing; inspection; soldering; buoyancy-correlated wetting time; delta kick force; electronics industry; incoming inspection; maximum withdrawal force; quantitative solderability testing; solderability number; standardization problems; wetting balance test methods; History; Inorganic materials; Inspection; Instruments; Lead; Materials testing; Performance evaluation; Time measurement; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, 1989. NAECON 1989., Proceedings of the IEEE 1989 National
  • Conference_Location
    Dayton, OH
  • Type

    conf

  • DOI
    10.1109/NAECON.1989.40499
  • Filename
    40499