• DocumentCode
    3094131
  • Title

    Air-coupled CMUTs operating at ambient pressures ranging from 1 to 20 atm

  • Author

    Min-Chieh Ho ; Kwan Kyu Park ; Eckhoff, Kristian ; Kupnik, Mario ; Khuri-Yakub, Butrus T.

  • Author_Institution
    Stanford Univ., Stanford, CA, USA
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1412
  • Lastpage
    1415
  • Abstract
    We present impedance and pitch-catch measurements of capacitive micromachined ultrasonic transducers (CMUTs) in permanent contact mode with improved mechanical strength that demonstrate functionality up to 20 atm ambient pressure. Changes in device design and fabrication are made to improve the mechanical strength of the CMUT plates, including using smaller deflection to thickness ratio (9 - 33%), choosing better quality SOI wafers (bowing <; 20 μm), and designing a much larger bonding area (300 - 700 μm overlap in radial direction) for each cell. As a result, all designs with 2000 μm radius, 65-μm-thick plates, 7.74 μm gap heights and with 300, 500, and 700 μm wide bonding area overlap for the plate, performed from 1 - 20 atm without a single failure. Despite larger bonding area, pitch-catch measurements with these CMUTs (700 μm bonding width biased at 250 V dc) still give received signal with good SNR even at 20 atm. Our results support that such CMUTs are reliable and efficient over a wide pressure range.
  • Keywords
    acoustic impedance; acoustic noise; acoustic signal processing; capacitive sensors; ultrasonic transducers; CMUT plates; SOI wafers; capacitive micromachined ultrasonic transducers; impedance measurements; mechanical strength; pitch-catch measurements; pressure 1 atm to 20 atm; signal-noise ratio; Acoustics; Bonding; Frequency measurement; Impedance; Impedance measurement; Pressure measurement; CMUT; FEA; electrical impedance; permanent contact mode; pitch-catch; wide pressure range;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0358
  • Filename
    6724920