DocumentCode
3094231
Title
Synthetic aperture 3D ultrasound imaging schemes with S-sequence bias-encoded top-orthogonal-to-bottom-electrode 2D CMUT arrays
Author
Sampaleanu, Alexander ; Zemp, Roger
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Alberta, Edmonton, AB, Canada
fYear
2013
fDate
21-25 July 2013
Firstpage
1994
Lastpage
1997
Abstract
Crossed electrode arrays, wherein electrodes are connected in individually addressable rows and columns, have been previously investigated as a means to reduce the number of channels in two-dimensional ultrasound arrays for three-dimensional imaging. Previously envisioned imaging schemes have been limited in their resolution and focusing ability due to their inability to perform active focusing in both the lateral and elevational direction for both transmit and receive. As well, signal-to-noise ratio (SNR) can be compromised when transmitting or receiving on only one row or column at a time. A new imaging method is proposed for this array architecture using capacitive micromachined ultrasound transducers (CMUTs) which can provide two-way focusing in both lateral and elevational directions while providing optimal SNR. This method is a variation of synthetic aperture imaging wherein the columns active upon transmit and receive events are determined by applying a bias to specific columns upon transmission and reception in an S-sequence encoded pattern. Mathematical derivations of this method are presented and simulations are done to compare this imaging method to previously published crossed-electrode array imaging schemes, as well as to fully-populated 2-D phased array imaging.
Keywords
acoustic imaging; acoustic transducers; S-sequence bias-encoded top-orthogonal-bottom-electrode 2D CMUT arrays; S-sequence encoded pattern; capacitive micromachined ultrasound transducers; electrode arrays; mathematical derivations; signal-noise ratio; synthetic aperture 3D ultrasound imaging; two-dimensional ultrasound arrays; Acoustics; Apertures; Imaging; Phased arrays; Signal to noise ratio; Switches; Ultrasonic imaging; 2-D array; 3-D imaging; CMUTs; Crossed-Electrode Array;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0509
Filename
6724924
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