DocumentCode
30943
Title
Random-Walk Drift-Diffusion Charge-Collection Model For Reverse-Biased Junctions Embedded in Circuits
Author
Glorieux, M. ; Autran, J.L. ; Munteanu, Daniela ; Clerc, Sylvain ; Gasiot, Gilles ; Roche, Philippe
Author_Institution
STMicroelectron., Crolles, France
Volume
61
Issue
6
fYear
2014
fDate
Dec. 2014
Firstpage
3527
Lastpage
3534
Abstract
A new computational model for charge transport based on parallelized random-walk drift-diffusion is proposed. This approach models the radiation-induced charge carriers as charge packets in a 3-D structure and the transport modeling are based on simple physical equations without any fitting parameter. This model has been dynamically coupled with a SPICE circuit simulator to take into account temporal variations of the electric fields in the charge collection process. Thus, the circuit electrical response modulates the charge collection efficiency. Three simulation cases have been explored and compared with TCAD simulations or radiation experiments in 65 nm technology to validate the accuracy of the proposed approach. These simulations demonstrate the capability of the proposed model to accurately estimate the soft error rate of complex structures, such as flip-flops over a large range of ionizing particle linear energy transfer. The proposed simulation methodology is also able to take into account charge-sharing phenomenon, and this point is highlighted by a specific investigation on the considered flip-flop.
Keywords
SPICE; flip-flops; integrated circuit modelling; radiation hardening (electronics); 3D structure; SPICE circuit simulator; TCAD simulations; charge collection efficiency; charge packets; charge transport modelling; charge-sharing phenomenon; circuit electrical response; complex structures; electric fields; flip-flops; ionizing particle linear energy transfer; parallelized random-walk drift-diffusion; physical equations; radiation-induced charge carriers; random-walk drift-diffusion charge-collection model; reverse-biased junctions; size 65 nm; soft error rate; Charge carriers; Circuit simulation; Integrated circuit modeling; Junctions; SPICE; Single event upsets; Charge collection; charge sharing; circuit modeling; radiation transport modeling; single-event modeling; single-event upset;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2014.2362073
Filename
6949164
Link To Document