• DocumentCode
    3094418
  • Title

    Derivation of accurate tensor data of materials in SAW devices by solving a parameter identification problem using an enhanced eigenvalue analysis of an infinite array model

  • Author

    Grunauer, Gerold ; Mayer, M. ; Knapp, Matthias ; Jaeger, Philipp ; Ebner, Thomas ; Wagner, Karl ; Pesch, Hans Josef

  • Author_Institution
    TDK Corp., Chiba, Japan
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1700
  • Lastpage
    1703
  • Abstract
    Accurate simulations of SAW elements require accurate material parameters. However, literature values, usually based on measurements of thick crystals, mostly don´t reflect the properties of thin film layers used within SAW devices with the necessary precision. In this work, a parameter identification procedure is presented, which can determine these material parameters based on measurements of admittance curves of SAW resonators and wave velocities within SAW delay lines. The optimization problem is solved using a surrogate model, where the surrogate models are built up efficiently and reliably using a predictor / corrector technique utilizing several iterative FEM techniques.
  • Keywords
    eigenvalues and eigenfunctions; electric admittance measurement; finite element analysis; iterative methods; optimisation; parameter estimation; predictor-corrector methods; surface acoustic wave resonators; tensors; SAW devices; SAW resonators; admittance curves measurements; delay lines; eigenvalue analysis enhancement; infinite array model; iterative FEM techniques; literature values; material parameters; optimization problem; parameter identification procedure; predictor-corrector technique; surrogate models; tensor data derivation; thick crystals; thin film layers; wave velocities; Computational modeling; Eigenvalues and eigenfunctions; Finite element analysis; Frequency measurement; Materials; Optimization; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0433
  • Filename
    6724933