50GB/s signaling on organic substrates using PMTL technology

Author

Yazdani, Farhang ; Izadian, Jamal S.

Author_Institution

BroadPak Corp., Santa Clara, CA

fYear

2009

fDate

16-18 March 2009

Firstpage

565

Lastpage

568

Abstract

As the Communication industry migrates toward 40 and 50 GB/s SER-DES interfaces and beyond the need for low cost packaging solution becomes mandated. PMTLtrade (patent pending) transmission line technology is emerging as a viable solution to high speed packaging. It is shown that PMTL can be used to achieve multi-gigahertz performance on low cost substrate materials. Signal integrity performance of PMTL and Stripline transmission lines realized on organic substrates are characterized and compared.

Keywords

ball grid arrays; electronics packaging; interconnections; organic compounds; strip lines; substrates; transmission lines; PMTL Technology; SER-DES interfaces; byte rate 50 GByte/s; interconnect; low cost packaging solution; organic substrates; patent pending transmission line technology; stripline transmission lines; Costs; Crosstalk; Frequency; Jitter; Packaging; Performance loss; Power transmission lines; Propagation losses; Signal analysis; Stripline; PCIE; PMTL; SATA; SER-DES; SSO; Xaui; analog; ceramic; electromagnetic; eye diagram; fullwave; interconnect; jitter; microwave; mixed-signal; mm-wave; organic; package; resonance; signal integrity; silicon; stripline; substrate;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design

Conference_Location

San Jose, CA

Print_ISBN

978-1-4244-2952-3

Electronic_ISBN

978-1-4244-2953-0

Type

conf

DOI

10.1109/ISQED.2009.4810356

Filename

4810356