DocumentCode
3095564
Title
SEU hardened clock regeneration circuits
Author
Dash, Rajballav ; Garg, Rajesh ; Khatri, Sunil P. ; Choi, Gwan
Author_Institution
Dept. of ECE, Texas A&M Univ., College Station, TX
fYear
2009
fDate
16-18 March 2009
Firstpage
806
Lastpage
813
Abstract
Single event upsets (SEUs) are becoming increasingly problematic for VLSI circuits due to device scaling, decreasing supply voltages and increasing operating frequencies. To deal with SEUs, radiation hardening is often employed to increase the reliability of VLSI systems. Most existing radiation hardening approaches focus on the combinational or sequential part of the design. Little or no attention has been paid to the impact of radiation particle strikes on the clock network of an IC. Recently, it has been shown that in the deep submicron regime, radiation particle strikes on clock networks can prove to be catastrophic. As a result, the clock network contributes significantly to the chip level soft error rate (SER). In this paper, we present two SEU hardened clock regenerator designs which are immune to radiation particle strikes. The new designs result in a significant reduction in SEU induced clock jitter. Experimental results demonstrate that our clock regenerator hardening approaches reduce the radiation induced jitter to around 30 ps and completely eliminates radiation induced voltage glitches, for radiation strikes with a deposited charge of up to 150 fC.
Keywords
VLSI; integrated circuit reliability; jitter; radiation hardening (electronics); SER; SEU; VLSI circuits; clock regeneration circuits; jitter; radiation hardening; reliability; single event upsets; soft error rate; Circuits; Clocks; Crosstalk; Error analysis; Frequency; Jitter; Radiation hardening; Single event upset; Very large scale integration; Voltage; Clock Regeneration; Single Event Upset (SEU); Soft Errors;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality of Electronic Design, 2009. ISQED 2009. Quality Electronic Design
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2952-3
Electronic_ISBN
978-1-4244-2953-0
Type
conf
DOI
10.1109/ISQED.2009.4810396
Filename
4810396
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