• DocumentCode
    3095722
  • Title

    A complete transmit, receive, and LO buffer chip set in low cost SMT package covering 38 & 42 GHz applications

  • Author

    Morkner, Henrik ; Fujii, Kenichi ; Kumar, Sudhakar ; Phan, Kenny ; Niedzwiecki, T. ; Ostermann, B.

  • Author_Institution
    Avago Technologies INC, San Jose, United States
  • fYear
    2010
  • fDate
    23-28 May 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    The higher frequency bands of the point-to-point infrastructure radio have been the hardest to convert to SMT package. This paper describes complete solution that covers 37–45GHz in 4 SMT packaged chips. Transmit consist of 2 chips, an up-converter/VGA with 20dB gain control and power amplifier that provides 38dBm OIP3. The receiver is a single chip down-converter with less than 4.9dB NF. The single chip LO buffer provides frequency multiplication (x2) and +21dBm drive with ample harmonic suppression. An optional high directivity, temperature compensated, power detector is also available to aid forward error correction. The result is the most integrated and complete chip set known to be published or advertised.
  • Keywords
    Costs; Frequency conversion; Gain control; Harmonics suppression; Noise measurement; Packaging; Power amplifiers; Radiofrequency amplifiers; Receivers; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-6056-4
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2010.5515236
  • Filename
    5515236