• DocumentCode
    309624
  • Title

    SAW interferometers using micromachined silicon plates

  • Author

    Meitzler, A.H. ; Sickafus, E.N. ; Costello, B. ; Wenzel, S.W.

  • Author_Institution
    Res. Lab., Ford Motor Co., Dearborn, MI, USA
  • Volume
    1
  • fYear
    1996
  • fDate
    3-6 Nov 1996
  • Firstpage
    443
  • Abstract
    A general purpose sensor structure has been invented that is based on the SAW propagation characteristics and the micromachining properties of silicon, single-crystal substrates. The two distinctive cavity shapes that are obtainable by micromachining a silicon die with a KOH etchant are used to define the beam paths needed to form a SAWI (Surface Acoustic Wave Interferometer). Design principles and fabrication procedures are described and results are presented. Devices with a silicon die size, 20 mm long and 10 mm wide, and with InterDigital Transducers (IDTs) using a 5 μm thick ZnO film and operating in the 60 to 100 MHz frequency range, have been built and tested. The ability of the basic structure to function as an interferometer has been demonstrated
  • Keywords
    acoustic wave interferometers; etching; interdigital transducers; micromachining; microsensors; silicon; surface acoustic wave sensors; 60 to 100 MHz; KOH etching; SAW interferometer; Si; ZnO; ZnO film; cavity shape; fabrication; interdigital transducer; micromachined silicon plate; sensor; silicon die; single-crystal substrate; Acoustic beams; Acoustic propagation; Etching; Interferometers; Micromachining; Sensor phenomena and characterization; Shape; Silicon; Substrates; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
  • Conference_Location
    San Antonio, TX
  • ISSN
    1051-0117
  • Print_ISBN
    0-7803-3615-1
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1996.584008
  • Filename
    584008