DocumentCode
309624
Title
SAW interferometers using micromachined silicon plates
Author
Meitzler, A.H. ; Sickafus, E.N. ; Costello, B. ; Wenzel, S.W.
Author_Institution
Res. Lab., Ford Motor Co., Dearborn, MI, USA
Volume
1
fYear
1996
fDate
3-6 Nov 1996
Firstpage
443
Abstract
A general purpose sensor structure has been invented that is based on the SAW propagation characteristics and the micromachining properties of silicon, single-crystal substrates. The two distinctive cavity shapes that are obtainable by micromachining a silicon die with a KOH etchant are used to define the beam paths needed to form a SAWI (Surface Acoustic Wave Interferometer). Design principles and fabrication procedures are described and results are presented. Devices with a silicon die size, 20 mm long and 10 mm wide, and with InterDigital Transducers (IDTs) using a 5 μm thick ZnO film and operating in the 60 to 100 MHz frequency range, have been built and tested. The ability of the basic structure to function as an interferometer has been demonstrated
Keywords
acoustic wave interferometers; etching; interdigital transducers; micromachining; microsensors; silicon; surface acoustic wave sensors; 60 to 100 MHz; KOH etching; SAW interferometer; Si; ZnO; ZnO film; cavity shape; fabrication; interdigital transducer; micromachined silicon plate; sensor; silicon die; single-crystal substrate; Acoustic beams; Acoustic propagation; Etching; Interferometers; Micromachining; Sensor phenomena and characterization; Shape; Silicon; Substrates; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1996. Proceedings., 1996 IEEE
Conference_Location
San Antonio, TX
ISSN
1051-0117
Print_ISBN
0-7803-3615-1
Type
conf
DOI
10.1109/ULTSYM.1996.584008
Filename
584008
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