DocumentCode :
3096350
Title :
Design and fabrication of a new multi-active-layer transducer with a single-copper-layer FPCB
Author :
Eunhee Shin ; Sangseok Lee ; Jongkil Kim ; Byungkuk Bae ; Heewon Kim ; Susung Lee ; Yongrae Roh
Author_Institution :
Probe Dev. Team, Alpinion Med. Syst., Seoul, South Korea
fYear :
2013
fDate :
21-25 July 2013
Firstpage :
1975
Lastpage :
1978
Abstract :
A diagnostic ultrasound transducer which operates at low frequency and has a small pitch has a high resultant element electrical impedance, aggravating the impedance mismatch which typically occurs between an ultrasound array and cable. A transducer constructed from multiple layers of active material that are electrically in parallel is one way to improve this impedance mismatch. Such a multi-active-layer transducer is most commonly composed of odd numbers of piezoelectric layers to simplify the electrical connections, so a three-layered structure is the simplest choice. But then the design thickness of each of the three PZT layers for a 3.5MHz transducer would be less than 100μm, which is too thin to fabricate easily and too risky to handle. In this paper, a two-active-layer structure is presented that reduces the breakage risk while achieving a lower impedance and thereby improving the transducer performance. A single-copper-layer flexible printed circuit board (FPCB) is developed to electrically connect the two PZT layers. The two-active-layer transducer presented is a phased array with a 3.5MHz center frequency, 150μm pitch, and 128 elements. The transducer is designed using a finite-element analysis program (PZflex) and then fabricated in accordance with the optimal design. The two-active-layer array performance is compared with a single-active-layer transducer that is similarly optimized.
Keywords :
biomedical electronics; biomedical transducers; biomedical ultrasonics; copper; electric impedance; finite element analysis; flexible electronics; lead compounds; multilayers; printed circuits; ultrasonic transducer arrays; PZT layers; PZT-Cu; diagnostic ultrasound transducer; electrical connections; finite-element analysis program; frequency 3.5 MHz; high resultant element electrical impedance; impedance mismatch; multiactive-iayer transducer design; multiactive-iayer transducer fabrication; piezoelectric layers; single-copper-Iayer flexible printed circuit board; single-copper-layer FPCB; three-layered structure; transducer performance; two-active-Iayer structure; ultrasound array; ultrasound cable; Computational modeling; Educational institutions; Impedance; Lenses; Polyimides; Transducers; Multi-active-layer transducer; Single-copper-layer FPCB; Two-active-layer-structure;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
ISSN :
1948-5719
Print_ISBN :
978-1-4673-5684-8
Type :
conf
DOI :
10.1109/ULTSYM.2013.0504
Filename :
6725030
Link To Document :
بازگشت