DocumentCode
3096446
Title
Development of high linearity duplexers with low passive intermodulation component
Author
Moriya, Atsushi ; Inoue, M. ; Kawachi, O.
Author_Institution
Taiyo Yuden Mobile Technol. Co., Ltd., Yokohama, Japan
fYear
2013
fDate
21-25 July 2013
Firstpage
737
Lastpage
740
Abstract
We have proposed surface acoustic wave (SAW) duplexer for CDMA/LTE markets. Advancements of the communication system are progressing in accordance with the increase of the data user needs. Technology that uses multi-band and simultaneous communication has been progressing. Effect of mutual interference in the mobile phone increases, deterioration of communication quality is concerned. Therefore, high frequency devices with lower intermodulation distortion (IMD) are required. In this paper, we found that the IMD value can be improved by optimizing the design of High Linearity duplexer using the non-linear SAW simulator which we developed [1]. Several non-linear terms are considered in this Non-linear simulation. Furthermore, in the IMD evaluation system, we used the Low-PIM cables, attenuators, connectors, and new Low-PIM Inductors which we developed for matching. As a result of the trial production of duplexer for BC0/Band13 system, we obtained about 20dB better than the conventional duplexer IMD value. In the future, we will promote optimum design considering to the material properties for further miniaturization and Higher-Linearity.
Keywords
Long Term Evolution; code division multiple access; intermodulation distortion; multiplexing equipment; surface acoustic wave transducers; BC0-Band13 system; CDMA markets; IMD evaluation system; LTE markets; SAW duplexer; data user needs; high frequency devices; high linearity duplexer; intermodulation distortion; multiband communication; mutual interference; nonlinear SAW simulator; passive intermodulation component; simultaneous communication; surface acoustic wave duplexer; Connectors; Degradation; Frequency measurement; Inductors; Jamming; Resonant frequency; Surface acoustic waves; Duplexer; Intermodulation distortion; Linearity; surface acoustic wave (SAW);
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0190
Filename
6725036
Link To Document