Title :
2D array transducer with a conductive backing
Author :
Jeongdong Woo ; Wonseok Lee ; SangGon Lee ; Yongrae Roh ; Hyungkeun Lee ; Byungkuk Bae ; Eunhee Shin ; Sunghag Kim
Author_Institution :
Sch. of Mech. Eng., Kyungpook Nat. Univ., Daegu, South Korea
Abstract :
A new conductive backing has been developed to improve transducer performance and manufacturability. For fabrication, conductive pillars were molded in a polymeric matrix through a process similar to that for the fabrication of 1-3 piezocomposites. The best combination of pillar and backing materials was selected from experiments to achieve the maximum acoustic performance (high impedance and attenuation) and channel uniformity. The 2D array transducer with 4096 channels built had a 3.5MHz center frequency and an over 60% fractional bandwidth. Every single channel of the prototype satisfied the target specifications and the standard deviation over the entire channels was within 0.81dB.
Keywords :
acoustic impedance; composite materials; filled polymers; moulding; piezoelectric materials; piezoelectric transducers; ultrasonic absorption; ultrasonic transducer arrays; 2D array transducer; acoustic properties; attenuation; conductive backing; conductive pillars; frequency 3.5 MHz; impedance; molding; piezocomposites; polymeric matrix; standard deviation; Arrays; Bandwidth; Fabrication; Graphite; Polymers; Transducers; 1–3 composite; Conductive backing; Ultrasonic array transducer; Volumetric imaging; component;
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
Print_ISBN :
978-1-4673-5684-8
DOI :
10.1109/ULTSYM.2013.0503