DocumentCode
3096805
Title
2D array transducer with a conductive backing
Author
Jeongdong Woo ; Wonseok Lee ; SangGon Lee ; Yongrae Roh ; Hyungkeun Lee ; Byungkuk Bae ; Eunhee Shin ; Sunghag Kim
Author_Institution
Sch. of Mech. Eng., Kyungpook Nat. Univ., Daegu, South Korea
fYear
2013
fDate
21-25 July 2013
Firstpage
1973
Lastpage
1974
Abstract
A new conductive backing has been developed to improve transducer performance and manufacturability. For fabrication, conductive pillars were molded in a polymeric matrix through a process similar to that for the fabrication of 1-3 piezocomposites. The best combination of pillar and backing materials was selected from experiments to achieve the maximum acoustic performance (high impedance and attenuation) and channel uniformity. The 2D array transducer with 4096 channels built had a 3.5MHz center frequency and an over 60% fractional bandwidth. Every single channel of the prototype satisfied the target specifications and the standard deviation over the entire channels was within 0.81dB.
Keywords
acoustic impedance; composite materials; filled polymers; moulding; piezoelectric materials; piezoelectric transducers; ultrasonic absorption; ultrasonic transducer arrays; 2D array transducer; acoustic properties; attenuation; conductive backing; conductive pillars; frequency 3.5 MHz; impedance; molding; piezocomposites; polymeric matrix; standard deviation; Arrays; Bandwidth; Fabrication; Graphite; Polymers; Transducers; 1–3 composite; Conductive backing; Ultrasonic array transducer; Volumetric imaging; component;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0503
Filename
6725053
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