• DocumentCode
    3096805
  • Title

    2D array transducer with a conductive backing

  • Author

    Jeongdong Woo ; Wonseok Lee ; SangGon Lee ; Yongrae Roh ; Hyungkeun Lee ; Byungkuk Bae ; Eunhee Shin ; Sunghag Kim

  • Author_Institution
    Sch. of Mech. Eng., Kyungpook Nat. Univ., Daegu, South Korea
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1973
  • Lastpage
    1974
  • Abstract
    A new conductive backing has been developed to improve transducer performance and manufacturability. For fabrication, conductive pillars were molded in a polymeric matrix through a process similar to that for the fabrication of 1-3 piezocomposites. The best combination of pillar and backing materials was selected from experiments to achieve the maximum acoustic performance (high impedance and attenuation) and channel uniformity. The 2D array transducer with 4096 channels built had a 3.5MHz center frequency and an over 60% fractional bandwidth. Every single channel of the prototype satisfied the target specifications and the standard deviation over the entire channels was within 0.81dB.
  • Keywords
    acoustic impedance; composite materials; filled polymers; moulding; piezoelectric materials; piezoelectric transducers; ultrasonic absorption; ultrasonic transducer arrays; 2D array transducer; acoustic properties; attenuation; conductive backing; conductive pillars; frequency 3.5 MHz; impedance; molding; piezocomposites; polymeric matrix; standard deviation; Arrays; Bandwidth; Fabrication; Graphite; Polymers; Transducers; 1–3 composite; Conductive backing; Ultrasonic array transducer; Volumetric imaging; component;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0503
  • Filename
    6725053