DocumentCode
3097040
Title
Charge-to-breakdown and trap generation process in thin oxides
Author
Bersuker, Gennadi ; Werking, James ; Chan, David Y.
Author_Institution
SEMATECH, Austin, TX, USA
fYear
1997
fDate
13-16 Oct 1997
Firstpage
62
Lastpage
66
Abstract
In the proposed model, trap generation is assumed to be triggered by the collision of injected electrons with oxide atoms. The model suggests that thinner oxides are less susceptible to charging stress due to both lower probability of electron collision and lower electron impact energy. The difference in positive and negative gate bias charge-to-breakdown data is attributed to the formation of a structural transition layer at the Si-SiO2 interface. The model is used for analysis of the effects of process induced charging damage on transistor parameters. It is found that after heavy stress, leakage current is determined by the probability of trap assisted tunneling, while the density of generated traps controls leakage in lightly damaged oxides
Keywords
MOS integrated circuits; MOSFET; dielectric thin films; electric breakdown; electron collisions; electron density; electron traps; hole traps; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; interface structure; leakage currents; probability; silicon compounds; surface charging; tunnelling; Si-SiO2; Si-SiO2 interface; charge-to-breakdown; charging stress; electron collision probability; electron impact energy; generated trap density; injected electron-oxide atom collisions; leakage current; model; negative gate bias charge-to-breakdown; oxide damage; oxide thickness; positive gate bias charge-to-breakdown; process induced charging damage model; structural transition layer; thin oxides; transistor parameters; trap assisted tunneling probability; trap generation; trap generation process; Antenna measurements; Atomic layer deposition; Bonding; Electric breakdown; Electron traps; Leakage current; Lighting control; Plasma measurements; Stress control; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-4205-4
Type
conf
DOI
10.1109/IRWS.1997.660284
Filename
660284
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