• DocumentCode
    3097040
  • Title

    Charge-to-breakdown and trap generation process in thin oxides

  • Author

    Bersuker, Gennadi ; Werking, James ; Chan, David Y.

  • Author_Institution
    SEMATECH, Austin, TX, USA
  • fYear
    1997
  • fDate
    13-16 Oct 1997
  • Firstpage
    62
  • Lastpage
    66
  • Abstract
    In the proposed model, trap generation is assumed to be triggered by the collision of injected electrons with oxide atoms. The model suggests that thinner oxides are less susceptible to charging stress due to both lower probability of electron collision and lower electron impact energy. The difference in positive and negative gate bias charge-to-breakdown data is attributed to the formation of a structural transition layer at the Si-SiO2 interface. The model is used for analysis of the effects of process induced charging damage on transistor parameters. It is found that after heavy stress, leakage current is determined by the probability of trap assisted tunneling, while the density of generated traps controls leakage in lightly damaged oxides
  • Keywords
    MOS integrated circuits; MOSFET; dielectric thin films; electric breakdown; electron collisions; electron density; electron traps; hole traps; integrated circuit measurement; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; interface structure; leakage currents; probability; silicon compounds; surface charging; tunnelling; Si-SiO2; Si-SiO2 interface; charge-to-breakdown; charging stress; electron collision probability; electron impact energy; generated trap density; injected electron-oxide atom collisions; leakage current; model; negative gate bias charge-to-breakdown; oxide damage; oxide thickness; positive gate bias charge-to-breakdown; process induced charging damage model; structural transition layer; thin oxides; transistor parameters; trap assisted tunneling probability; trap generation; trap generation process; Antenna measurements; Atomic layer deposition; Bonding; Electric breakdown; Electron traps; Leakage current; Lighting control; Plasma measurements; Stress control; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1997 IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-4205-4
  • Type

    conf

  • DOI
    10.1109/IRWS.1997.660284
  • Filename
    660284