DocumentCode :
3097496
Title :
Plasmonic materials and metamaterials by bottom-up approach: Manufacturing and properties
Author :
Pawlak, Dorota A. ; Gajc, Marcin ; Osewski, Pawel ; Sadecka, Katarzyna ; Stefanski, Andrzej ; Klos, Andrzej ; Belardini, Alessandro ; Leahu, Grigore ; Sibilia, Concita
Author_Institution :
Institute of Electronic Materials Technology (ITME), Warsaw, Poland
fYear :
2013
fDate :
23-27 June 2013
Firstpage :
1
Lastpage :
1
Abstract :
Two novel bottom-up manufacturing methods for manufacturing of plasmonic materials and metamaterials will be presented based on: (i) directional solidification of eutectic composites [1] and (ii) doping dielectric matrices with plasmonic nanoparticles [2]. Eutectics are simultaneously monolithic and multiphase materials forming self-organized micro/nanostructures, which enable: (i) the use of various component materials including oxides, semiconductors, metals, (ii) the generation of a gallery of geometrical motifs and (iii) control of the size of the structuring, often from the micro- to nanoregimes. On the other hand, the novel method of NanoParticles Direct Doping [2] enables doping of dielectric matrices with various nanoparticles (varying chemical composition, size and shape). Utilizing this newly developed method we demonstrate three-dimensional nanoplasmonic materials with plasmonic resonances at different wavelengths. In both cases we apply one of the crystal growth methods (the micro-pulling down method) to create the material. Bulk materials with plasmonic resonances at visible and IR wavelengths, with enhanced photoluminescence as well as anomalous refraction will be presented, evaluated by the beam deviation measurements [3]. Our new approach may lead to novel manufacturing solutions for photonic applications in areas such as metamaterials, plasmonics, as well as energy systems.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transparent Optical Networks (ICTON), 2013 15th International Conference on
Conference_Location :
Cartagena, Spain
ISSN :
2161-2056
Type :
conf
DOI :
10.1109/ICTON.2013.6602867
Filename :
6602867
Link To Document :
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