• DocumentCode
    3097784
  • Title

    Normally-off InAlN/GaN HEMTs with n++ GaN cap layer: A simulation study

  • Author

    Vitanov, Stanislav ; Kuzmik, J. ; Palankovski, Vassil

  • Author_Institution
    Adv. Mater. & Device Anal. Group, Tech. Univ. Vienna, Vienna, Austria
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The ongoing interest in the development of GaN-based enhancement-mode high electron mobility transistors (EHEMTs) resulted in several different approaches being proposed, one of them employing a reduction of the gate-to-channel distance. In order to facilitate gate recessing, a technique using a n++ cap layer was suggested by Kuzmik et al., who also analyzed the contribution of the cap layer to current conduction and on the mechanism of the off-state breakdown. In this work we complement the experimental results with two-dimensional device simulation using Minimos-NT. We have employed it previously for the optimization studies of a whole generation of AlGaN/GaN HEMTs, but also for high-temperature simulations.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; indium compounds; wide band gap semiconductors; InAlN-GaN; Minimos-NT; current conduction; gate-to-channel distance; high-temperature simulations; n++ cap layer technique; normally-off HEMT; off-state breakdown; two-dimensional device simulation; Current density; Electric fields; Gallium nitride; HEMTs; Integrated circuit modeling; Logic gates; MODFETs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135161
  • Filename
    6135161