Title :
Bondwire array modeling for the design of hybrid high power amplifiers above C-band
Author :
Cilla, C. ; Jonasson, S.T. ; Hanberg, J.
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. of Denmark, Lyngby, Denmark
Abstract :
This paper presents a bondwire array model obtained using a software based on the finite elements method and validated up to 15 GHz by measurements over a purpose-build array structure. This work addresses the limits of the inductor-based bondwire model when used at frequencies above C-band to simulate the large bondwire arrays that are used in long multi-transistor power bars. The usefulness of an accurate 3D EM model during the amplifier´s matching network design process is highlighted using a practical example, and the effect of the insertion loss variations along the different bondwires comprising the array on the hybrid performance is discussed.
Keywords :
finite element analysis; hybrid integrated circuits; inductors; integrated circuit packaging; power amplifiers; semiconductor device packaging; wafer bonding; 3D EM model; C-band; amplifier matching network design process; bondwire array modeling; finite elements method; hybrid high power amplifiers; hybrid integrated circuit; inductor-based bondwire model; insertion loss variations; integrated circuit packaging; multitransistor power bars; power transistors; purpose-build array structure; semiconductor device packaging; wafer bonding; Arrays; Computational modeling; Hybrid power systems; Integrated circuit modeling; Mathematical model; Solid modeling; Transistors; High power amplifier; Hybrid integrated circuits; Integrated circuit packaging; Power transistors; Semiconductor device packaging; Wafer bonding;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4577-1330-9
Electronic_ISBN :
978-1-4577-1331-6
DOI :
10.1109/APMC.2012.6421756
