Electrical design and analysis from die level to system level in advanced semiconductor engineering group

Author

Chen-Chao Wang ; Ji-Han Chen ; Kuo-Hua Chen ; Chi-Tsung Chiu

Author_Institution

Product Design Div., Adv. Semicond. Eng. (ASE) Inc., Kaohsiung, Taiwan

fYear

2012

fDate

4-7 Dec. 2012

Firstpage

875

Lastpage

877

Abstract

The scope of advanced semiconductor engineering (ASE) Inc. developments on microwave field including integration passive device (IPD), system-in-package (SiP), through silicon via (TSV), signal integrity(SI) and power integrity (PI) on system level, and Co-design/Co-simulation together with device modeling, integrated system analysis, measurement techniques over 60GHz, and design automatic platform have been presented. In this paper, the major development techniques at ASE will be introduced.

Keywords

integrated circuit design; millimetre wave integrated circuits; millimetre wave measurement; ASE; IPD; SiP; TSV; advanced semiconductor engineering group; codesign-cosimulation; die level; electrical design; integration passive device; measurement techniques; microwave field; power integrity; signal integrity; system-in-package; through silicon via; Integrated circuit modeling; Layout; Metals; Semiconductor device measurement; Silicon; Through-silicon vias; Co-design; Co-simulation; IPD; OSD; PI; SI; TSV;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2012 Asia-Pacific

Conference_Location

Kaohsiung

Print_ISBN

978-1-4577-1330-9

Electronic_ISBN

978-1-4577-1331-6

Type

conf

DOI

10.1109/APMC.2012.6421764

Filename

6421764