• DocumentCode
    3098791
  • Title

    Pd-InGaAs as a new self-aligned contact material on InGaAs

  • Author

    Kong, Eugene Y -J ; Zhang, Xingui ; Ivana ; Zhou, Qian ; Yeo, Yee-Chia

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore (NUS), Singapore, Singapore
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Introduction. Self-alignment of source/drain (S/D) contacts to the transistor gate is important, as it brings the S/D contacts close to the channel and allows the achievement of low parasitic S/D series resistance RSD. Low RSD is needed for high-mobility and short-channel transistors where the channel resistance is low and external resistance is a significant proportion of the total resistance between source and drain. Fig. 1 illustrates the self-aligned S/D contact metallization process for InGaAs transistors. Recently, the first self-aligned Ni-InGaAs S/D contacts were demonstrated.1, 2 In this work, Pd-InGaAs is explored as a new self-aligned contact metallization technology.
  • Keywords
    III-V semiconductors; MOSFET; electric resistance; gallium arsenide; indium compounds; metallisation; palladium; semiconductor-metal boundaries; Pd-InGaAs; channel resistance; high-mobility transistor; parasitic S-D series resistance; selfaligned S-D contact metallization process; selfaligned contact material; short-channel transistor; source-drain contact; transistor gate; Annealing; Films; Indium gallium arsenide; Metals; Resistance; Substrates; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135216
  • Filename
    6135216