DocumentCode
3099059
Title
Impact-absorbing effect by applying ultrasonic vibrations to high-tensile steel plate
Author
Suzuki, A. ; Onitake, Takahiro ; Ikunaka, Kanji ; Tsujino, Jiromaru
Author_Institution
Dept. of Mech. & Electr. Eng., Tokuyama Coll. of Technol., Tokuyama, Japan
fYear
2013
fDate
21-25 July 2013
Firstpage
1650
Lastpage
1653
Abstract
The stress induced during the plastic deformation of metals decreases with the application of ultrasonic vibrations. This effect is currently employed in industrial operations such as bending. Now, we note that the rigidity of a traditional crushable zone does not change instantaneously. In this light, in this study, we aim to develop an impact-absorbing system by applying ultrasonic vibrations that can change the rigidity of crushable zones instantaneously in the event of a traffic accident. Ultrasonic vibrations reduce not only the stress but also the springback amount. If the decrease in the latter effectively prevents the rebound of the colliding object, damage after rebounding will be reduced. In this study, we developed an experimental device to confirm the impact-absorbing effect by applying ultrasonic vibrations to a high-tensile steel plate. We measured the springback amount, impact-absorbing characteristics, and so on. The springback amount was reduced by up to 43% by the application of ultrasonic vibrations. The impact force was reduced by up to 35% by the application of ultrasonic vibrations.
Keywords
impact (mechanical); plastic deformation; plates (structures); shear modulus; steel; structural acoustics; structural engineering; vibrations; bending; crushable zones; high-tensile steel plates; impact force; impact-absorbing effect; plastic deformation; rigidity; springback; ultrasonic vibrations; Acoustics; Force; Steel; Ultrasonic transducers; Ultrasonic variables measurement; Vibrations; Voltage measurement; Blaha effect; high-tensile steel; impact absorber; impact absorption; ultrasonic vibration;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location
Prague
ISSN
1948-5719
Print_ISBN
978-1-4673-5684-8
Type
conf
DOI
10.1109/ULTSYM.2013.0420
Filename
6725165
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