The concept of relative damage stress and its application to electronic packaging solder joint reliability

Author

Ma, Xin ; Qian, Yiyu ; Zhang, Xiaoming

Author_Institution

Res. & Anal. Center, CEPREI, Guangzhou, China

fYear

2001

fDate

2001

Firstpage

128

Lastpage

131

Abstract

A new mechanical concept, relative damage stress, which can mechanically reflect the failure mechanism of solder joints used in electronic packaging in full-scale, has been proposed. Based upon the new mechanical concept, the thermal fatigue life data of surface mount solder joints have been reasonably analyzed, something that traditional mechanical concepts, such as Mises equivalent stress, can not do. Some suggestions have been provided for the design of accelerated thermal fatigue tests of PCB-level electronic assembly

Keywords

circuit reliability; failure analysis; finite element analysis; internal stresses; life testing; printed circuit manufacture; printed circuit testing; surface mount technology; thermal stress cracking; Mises equivalent stress; PCB-level electronic assembly; accelerated thermal fatigue test design; electronic packaging; electronic packaging solder joint reliability; failure mechanism; finite element model; mechanical concept; relative damage stress; solder joints; surface mount solder joints; thermal fatigue life data; Assembly; Ceramics; Electronic packaging thermal management; Electronics packaging; Failure analysis; Fatigue; Finite element methods; Life estimation; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International

Conference_Location

Orlando, FL

Print_ISBN

0-7803-6587-9

Type

conf

DOI

10.1109/RELPHY.2001.922892

Filename

922892