• DocumentCode
    3099158
  • Title

    An analysis of the frequency-temperature relations of SC-cut quartz crystal plates with the Lee plate theory

  • Author

    Tingfeng Ma ; Wejun Wang ; Rongxing Wu ; Jianke Du ; Dejin Huang ; Ji Wang

  • Author_Institution
    Piezoelectr. Device Lab., Ningbo Univ., Ningbo, China
  • fYear
    2013
  • fDate
    21-25 July 2013
  • Firstpage
    1021
  • Lastpage
    1024
  • Abstract
    The analysis of high frequency vibrations of piezoelectric crystal plates at the thickness-shear modes are of great importance in resonator design. In addition to fundamental issues like the vibration frequency, practical needs on the effects of complication factors such as the electrodes and temperature fluctuation are also required to be available for the optimal selection of structural parameters. With the modified Lee plate equations and thermal field considered, the frequency-temperature relations which are essential in the quartz crystal resonator development have been investigated. As we have found, the frequency change from the Lee plate theory in the operation range of a quartz crystal resonator is consistent with predications of Mindlin plate theory. We now are able to design resonators with the choice of Mindlin or Lee plate equations based on individual choices.
  • Keywords
    crystal resonators; fluctuations; high-frequency effects; piezoelectric materials; plates (structures); quartz; vibrational modes; vibrations; Lee plate equations; Lee plate theory; Mindlin plate theory; SC-cut quartz crystal plates; SiO2; complication factor effects; electrode fluctuation; frequency-temperature relation; high frequency vibrations; piezoelectric crystal plates; quartz crystal resonator development; resonator design; structural parameters; temperature fluctuation; thermal field; thickness-shear modes; vibration frequency; Crystals; Dispersion; Equations; Mathematical model; Resonant frequency; Thermal analysis; Vibrations; crystal; frequency; quartz; resonator; temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2013 IEEE International
  • Conference_Location
    Prague
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-5684-8
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2013.0262
  • Filename
    6725170