• DocumentCode
    3099239
  • Title

    Real case study for isothermal EM test as a process control methodology

  • Author

    Shun-Yi Lee ; Lai, J.B. ; Lee, S.C. ; Chu, L.H. ; Huang, Y.S. ; Shiue, R.Y. ; Peng, Yeng K. ; Yue, J.T.

  • Author_Institution
    Relibility Assurance Dept., Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    184
  • Lastpage
    188
  • Abstract
    The isothermal electromigration (EM) test is a very quick method to evaluate metal quality (Jones and Smith, 1987). However, most people do not have adequate confidence in its accuracy due to the fact that its failure mechanism is not easily controlled. By carefully controlling the failure criteria, we have shown that the failure mechanism in isothermal is similar to that of conventional EM tests. The isothermal test has been shown to be a good method to evaluate the metallization process in a production line. In this work, we first determined the failure criterion of isothermal EM from resistance degradation with stress time. We found that the failure mode of isothermal test under control was the same as that of package level electromigration. Furthermore, we used the failure criterion (delta R/R0=2%) to extract activation energy and found the result to be extremely encouraging. The activation energies from conventional EM tests and isothermal tests are almost the same. From failure mode and activation energy analysis, the isothermal failure mechanism could be clearly identified. Furthermore, skew lots and maverick lots were differentiated from normal production lots, thereby successfully demonstrating the value of this new test methodology in volume manufacturing
  • Keywords
    electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; process control; production testing; thermal stresses; EM tests; activation energy; controlled failure mechanism; failure criteria; failure criterion; failure mechanism; failure mode; isothermal EM test; isothermal electromigration test; isothermal failure mechanism; isothermal test; maverick lots; metal quality; metallization process; package level electromigration; process control methodology; production line; production lots; resistance degradation; skew lots; stress time; volume manufacturing; Degradation; Electromigration; Failure analysis; Isothermal processes; Metallization; Packaging; Process control; Production; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2001. Proceedings. 39th Annual. 2001 IEEE International
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-6587-9
  • Type

    conf

  • DOI
    10.1109/RELPHY.2001.922899
  • Filename
    922899