• DocumentCode
    3099299
  • Title

    Design and analysis of multi-gate field-effect-diodes for embedded memory

  • Author

    Chbili, Zakariae ; Yang, Yang ; Li, Qiliang ; Ioannou, Dimitris E.

  • Author_Institution
    ECE Dept., George Mason Univ., Fairfax, VA, USA
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Memory arrays consume a very large area in chip designs; yet memory cell scaling lags significantly transistor scaling. With transistor channel lengths in the nanoscale regime, the six transistor static random access memory cell (6T-SRAM) and the single transistor dynamic memory (DRAM) cell both suffer from excessive leakage current. Consequently, there is a widely recognized need for urgent progress in memory technology.
  • Keywords
    DRAM chips; SRAM chips; embedded systems; field effect devices; semiconductor diodes; chip design; embedded memory; leakage current; memory array; memory cell scaling; multigate field-effect-diode; nanoscale regime; single transistor dynamic memory cell; transistor channel length; transistor scaling; transistor static random access memory cell; Cathodes; Educational institutions; Logic gates; P-i-n diodes; Random access memory; Transistors; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium (ISDRS), 2011 International
  • Conference_Location
    College Park, MD
  • Print_ISBN
    978-1-4577-1755-0
  • Type

    conf

  • DOI
    10.1109/ISDRS.2011.6135246
  • Filename
    6135246