Title :
Design of a low-cost self-aligned MCM-D based optical data link
Author :
Dautartas, M.F. ; Benzoni, A.M.
Author_Institution :
Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
fDate :
31 Oct-3 Nov 1994
Abstract :
In this paper we discuss methods to significantly reduce the cost of optical data links (ODLs) by simplifying the design, reducing the piece part count, using high-volume manufacturing techniques, and using an integrated design approach based on Design For Manufacture/Design For Simplicity (DFM/DFS) principles. By taking advantage of available technologies, such as silicon micromachining, multi-chip module (MCM-D) technology, solder-bump self-alignment, and plastic packaging, we present a design concept that can cost reduce ODLs and add value by reducing the package size
Keywords :
optical fibre communication; DFM/DFS; Design For Manufacture/Design For Simplicity; MCM-D; cost; design; high-volume manufacturing; multi-chip module; optical data link; plastic packaging; silicon micromachining; solder-bump self-alignment; Costs; Integrated circuit interconnections; Lenses; Light emitting diodes; Optical coupling; Optical design; Optical devices; Optical interconnections; Optical transmitters; Wafer bonding;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-1470-0
DOI :
10.1109/LEOS.1994.586896
