Design of a low-cost self-aligned MCM-D based optical data link

Author

Dautartas, M.F. ; Benzoni, A.M.

Author_Institution

Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA

Volume

1

fYear

1994

fDate

31 Oct-3 Nov 1994

Firstpage

71

Abstract

In this paper we discuss methods to significantly reduce the cost of optical data links (ODLs) by simplifying the design, reducing the piece part count, using high-volume manufacturing techniques, and using an integrated design approach based on Design For Manufacture/Design For Simplicity (DFM/DFS) principles. By taking advantage of available technologies, such as silicon micromachining, multi-chip module (MCM-D) technology, solder-bump self-alignment, and plastic packaging, we present a design concept that can cost reduce ODLs and add value by reducing the package size

Keywords

optical fibre communication; DFM/DFS; Design For Manufacture/Design For Simplicity; MCM-D; cost; design; high-volume manufacturing; multi-chip module; optical data link; plastic packaging; silicon micromachining; solder-bump self-alignment; Costs; Integrated circuit interconnections; Lenses; Light emitting diodes; Optical coupling; Optical design; Optical devices; Optical interconnections; Optical transmitters; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE

Conference_Location

Boston, MA

Print_ISBN

0-7803-1470-0

Type

conf

DOI

10.1109/LEOS.1994.586896

Filename

586896