DocumentCode
3100771
Title
Impedance formulas of a bond wire array with analytical method of moments (MoM)
Author
Liming Gu ; Wenquan Che ; Jingxian Gan ; Chow, Yung Leonard
Author_Institution
Dept. of Commun. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
fYear
2012
fDate
4-7 Dec. 2012
Firstpage
1250
Lastpage
1252
Abstract
The analytical moment method (MoM) is used to analyze the equivalence of a bond plate and an array of bond wires and some equations have been derived. To verify the validity of the proposed theory, several structures with different dimensions of bond wires have been analyzed and simulated up to 10 GHz. In case of different bond wire configurations, good agreements have been achieved between the theoretical analyses and simulation results. With the help of the proposed analytical method, the computing time of bond wires by commercial electromagnetic calculation software can be tremendously reduced.
Keywords
method of moments; wires (electric); analytical method of moments; analytical moment method; bond plate; bond wire array; bond wire configuration; electromagnetic calculation software; impedance formulas; Arrays; Bonding; Equations; Impedance; Moment methods; Software; Wires; Analytical MoM; bond plate; bond wires; impedance formula; modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location
Kaohsiung
Print_ISBN
978-1-4577-1330-9
Electronic_ISBN
978-1-4577-1331-6
Type
conf
DOI
10.1109/APMC.2012.6421885
Filename
6421885
Link To Document