• DocumentCode
    3100771
  • Title

    Impedance formulas of a bond wire array with analytical method of moments (MoM)

  • Author

    Liming Gu ; Wenquan Che ; Jingxian Gan ; Chow, Yung Leonard

  • Author_Institution
    Dept. of Commun. Eng., Nanjing Univ. of Sci. & Technol., Nanjing, China
  • fYear
    2012
  • fDate
    4-7 Dec. 2012
  • Firstpage
    1250
  • Lastpage
    1252
  • Abstract
    The analytical moment method (MoM) is used to analyze the equivalence of a bond plate and an array of bond wires and some equations have been derived. To verify the validity of the proposed theory, several structures with different dimensions of bond wires have been analyzed and simulated up to 10 GHz. In case of different bond wire configurations, good agreements have been achieved between the theoretical analyses and simulation results. With the help of the proposed analytical method, the computing time of bond wires by commercial electromagnetic calculation software can be tremendously reduced.
  • Keywords
    method of moments; wires (electric); analytical method of moments; analytical moment method; bond plate; bond wire array; bond wire configuration; electromagnetic calculation software; impedance formulas; Arrays; Bonding; Equations; Impedance; Moment methods; Software; Wires; Analytical MoM; bond plate; bond wires; impedance formula; modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
  • Conference_Location
    Kaohsiung
  • Print_ISBN
    978-1-4577-1330-9
  • Electronic_ISBN
    978-1-4577-1331-6
  • Type

    conf

  • DOI
    10.1109/APMC.2012.6421885
  • Filename
    6421885