Title :
Investigation of delay path modifications of Surface Acoustic Wave sensors
Author :
Richardson, Mark ; Koochakzadeh, S. ; Bhethanabotla, Venkat R. ; Suthar, Kamlesh ; Sankaranarayanan, Subramanian K. R. S.
Author_Institution :
Dept. of Chem. & Biomed. Eng., Univ. of South Florida, Tampa, FL, USA
Abstract :
Surface Acoustic Wave (SAW) sensors monitor the interaction between a receptor and its target in real time through changes in the properties of the traveling wave (i.e. frequency or phase, and amplitude). A key sensing parameter is power consumption. To increase power transfer we have developed a SAW sensor with microcavities in the delay path on 36° YX LiTaO3 and 90° ST-X Quartz. Three parameters were identified that determine the effectiveness of microcavities: 1) IDT offset, 2) microcavity depth, and 3) microcavity cross-sectional area. Finite element (FE) simulations were performed using ANSYS to determine the optimum value of each parameter to decrease insertion loss (I.L.). Our results show that the best parameter values are; IDT offset = 10 μm, microcavity depth = 2.5 μm and microcavity cross-sectional area = 10 μm × 10 μm, for a device with center frequency of about 100 MHz.
Keywords :
finite element analysis; interdigital transducers; lithium compounds; microcavities; microsensors; quartz; surface acoustic wave sensors; surface acoustic wave transducers; ANSYS simulation; FE simulation; IDT offset; IL; LiTaO3; SAW sensor; ST-X quartz; delay path modification; depth 2.5 mum; finite element simulation; insertion loss; microcavity depth; power consumption; power transfer; surface acoustic wave sensor; traveling wave property; Finite element analysis; Lithium compounds; Microcavities; Sensors; Substrates; Surface acoustic wave devices; Surface acoustic waves; FEM; ST-quartz; Surface Acoustic Wave (SAW); insertion loss; lithium tantalate; microcavities;
Conference_Titel :
Ultrasonics Symposium (IUS), 2013 IEEE International
Conference_Location :
Prague
Print_ISBN :
978-1-4673-5684-8
DOI :
10.1109/ULTSYM.2013.0496