DocumentCode
310095
Title
Opto-electronic packaging of 2-D surface active devices
Author
Basavanhally, Nagesh R. ; Brady, Michael F. ; Buchholz, D. Burce
Author_Institution
AT&T Bell Labs., Princeton, NJ, USA
Volume
1
fYear
1994
fDate
31 Oct-3 Nov 1994
Firstpage
215
Abstract
Summary form only given. A packaging scheme which provides both optical alignment and electrical interconnection during a single assembly process for SEED chip has been presented. The assembly of the package is cost-effective because the design lends itself to a batch assembly process. This packaging technique can be easily extended to other types of 2-D surface emitting devices
Keywords
SEEDs; 2D surface active devices; 2D surface emitting devices; SEED chip; batch assembly process; cost-effective; electrical interconnection; optical alignment; optical interconnections; optoelectronic packaging; packaging scheme; packaging technique; single assembly process; Assembly; Lenses; Microoptics; Optical buffering; Optical devices; Optical interconnections; Packaging; Space technology; Temperature; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location
Boston, MA
Print_ISBN
0-7803-1470-0
Type
conf
DOI
10.1109/LEOS.1994.586969
Filename
586969
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