Title :
High-speed high-density parallel free-space optical interconnections
Author :
Tsang, D.Z. ; Roussell, H.V. ; Woodhouse, J.D. ; Donnelly, J.P. ; Wang, C.A. ; Spears, D.L. ; Bailey, R.J. ; Mull, D.E. ; Pedrotti, K.D. ; Seabury, C.W.
Author_Institution :
Lincoln Lab., MIT, Lexington, MA, USA
fDate :
31 Oct-3 Nov 1994
Abstract :
Summary form only given. Modules which implement high-density parallel free-space board-to-board optical interconnections have been constructed with linear arrays of components. These free-space optical interconnections provide the capability for dense z-axis interconnections perpendicular to boards or multichip modules. Each parallel interconnection contains an edge-emitting InGaAs laser array, transmitter and receiver lens arrays, and an InGaAs detector array flip-chip attached to a GaAs heterojunction bipolar transistor amplifier array
Keywords :
optical interconnections; GaAs heterojunction bipolar transistor amplifier array; InGaAs; InGaAs detector array; dense z-axis interconnections; edge-emitting InGaAs laser array; flip-chip attached; free-space optical interconnections; high-density parallel free-space board-to-board optical interconnections; high-speed high-density parallel free-space optical interconnections; intergrated optoelectronics; linear arrays; multichip modules; parallel interconnection; receiver lens arrays; transmitter lens array; Gallium arsenide; High speed optical techniques; Indium gallium arsenide; Lenses; Multichip modules; Optical arrays; Optical interconnections; Optical receivers; Optical transmitters; Sensor arrays;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-1470-0
DOI :
10.1109/LEOS.1994.586970
