DocumentCode
310097
Title
Micro-machined micro-optical bench for optoelectronic packaging
Author
Lin, L.Y. ; Lee, S.S. ; Pister, K.S.J. ; Wu, M.C.
Author_Institution
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
Volume
1
fYear
1994
fDate
31 Oct-3 Nov 1994
Firstpage
219
Abstract
Summary form only given. We report a novel scheme for optoelectronic packaging using surface micro-machining technique. Free space micro-optical benches (MOB) enable a large optical system to be monolithically integrated on a small Si chip. In this paper, we present a novel rotatable micro-mirror, and a three dimensional self-alignment structure for integrating active optical components such as semiconductor lasers or isolators on MOB
Keywords
silicon; active optical components; free space micro-optical benches; large optical system; micro-machined micro-optical bench; monolithically integrated; optical isolators; optoelectronic packaging; rotatable micro-mirror; semiconductor lasers; small Si chip; surface micro-machining technique; three dimensional self-alignment structure; Optical devices; Optical sensors; Optical surface waves; Optical waveguides; Packaging; Semiconductor lasers; Silicon; Sprites (computer); Substrates; Surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location
Boston, MA
Print_ISBN
0-7803-1470-0
Type
conf
DOI
10.1109/LEOS.1994.586971
Filename
586971
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