DocumentCode
310098
Title
Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)
Author
Wong, Y.M. ; Muehlner, D.J. ; Gates, J.V. ; Anthony, P.J.
Author_Institution
AT&T Bell Labs., Murray Hill, NJ
Volume
1
fYear
1994
fDate
31 Oct-3 Nov 1994
Abstract
Summary form only given. A parallel, 32 channel, high density (140 μm pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed
Keywords
optical fibre networks; 140 mum; 16 Gbit/s; 32-channe; GaAs; GaAs IC; NRZ optical data link; Si; high density; link characterization; multichip module technologies; optical data link; optoelectronic packaging technology development; optoelectronic technology consortium; packaging designs; silicon optical bench; Gallium arsenide; Multichip modules; Optical signal processing; Packaging; Photonic integrated circuits; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location
Boston, MA
Print_ISBN
0-7803-1470-0
Type
conf
DOI
10.1109/LEOS.1994.586972
Filename
586972
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