Title :
Optoelectronic packaging technology development of a high density 32-channel 16 Gbps optical data link for the optoelectronic technology consortium (OETC)
Author :
Wong, Y.M. ; Muehlner, D.J. ; Gates, J.V. ; Anthony, P.J.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ
fDate :
31 Oct-3 Nov 1994
Abstract :
Summary form only given. A parallel, 32 channel, high density (140 μm pitch) 500 Mbps/channel NRZ optical data link has been successfully fabricated using existing GaAs IC, silicon optical bench, and multichip module technologies. Packaging designs, its implementation, and link characterization will be discussed
Keywords :
optical fibre networks; 140 mum; 16 Gbit/s; 32-channe; GaAs; GaAs IC; NRZ optical data link; Si; high density; link characterization; multichip module technologies; optical data link; optoelectronic packaging technology development; optoelectronic technology consortium; packaging designs; silicon optical bench; Gallium arsenide; Multichip modules; Optical signal processing; Packaging; Photonic integrated circuits; Silicon;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1994. LEOS '94 Conference Proceedings. IEEE
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-1470-0
DOI :
10.1109/LEOS.1994.586972
