DocumentCode :
3101025
Title :
Manufacture of novel double-side direct thru kit with nonexchange layer structure base on general PCB process
Author :
Ting-Han Chien ; Wen-Yi Ruan ; Lung-Shu Huang ; Sung-Mao Wu ; Wei-Chi Chen
Author_Institution :
Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
fYear :
2012
fDate :
4-7 Dec. 2012
Firstpage :
1283
Lastpage :
1285
Abstract :
In this paper, the novel double-side direct thru kit with non-exchange layer structure is presented. The thru element of open-short-load-thru (SOLT) had been realized base on co-planar waveguide structure by the proposed manufacture flow. The results of thru element are measured by Cascade ACP type RF probe in 3D double-side measurement system. The operating bandwidth is 13.7 GHz with upon -0.2dB forward insertion loss and below -20dB return loss.
Keywords :
coplanar waveguides; printed circuit manufacture; 3D double side measurement system; cascade ACP type RF probe; coplanar waveguide structure; frequency 13.7 GHz; general PCB process; nonexchange layer structure; novel double side direct thru kit; open short load thru; Calibration; Coplanar waveguides; Fasteners; Fitting; Probes; Semiconductor device measurement; Substrates; Calibration; VNA; double-side calibration kit; manufacture; measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings (APMC), 2012 Asia-Pacific
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4577-1330-9
Electronic_ISBN :
978-1-4577-1331-6
Type :
conf
DOI :
10.1109/APMC.2012.6421896
Filename :
6421896
Link To Document :
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