DocumentCode :
3101399
Title :
Twenty fifth annual IEEE Semiconductor Thermal Measurement and Management Symposium
fYear :
2009
fDate :
15-19 March 2009
Abstract :
The following topics are dealt with: semiconductor thermal measurement and management; thermal market and technology drivers for the future; two phase cooling; modeling and simulation; fans and pumps; microchannel cooling; die level cooling; thermal interface materials; innovative cooling; and package level cooling.
Keywords :
cooling; fans; pumps; thermal management (packaging); die level cooling; fans and pumps; innovative cooling; microchannel cooling; package level cooling; semiconductor thermal management; semiconductor thermal measurement; technology drivers; thermal interface materials; thermal market; two phase cooling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location :
San Jose, CA
ISSN :
1065-2221
Print_ISBN :
978-1-4244-3664-4
Electronic_ISBN :
1065-2221
Type :
conf
DOI :
10.1109/STHERM.2009.4810725
Filename :
4810725
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3101399
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