Validation and sensitivity analysis of an image processing technique to derive thermal conductivity variation within a printed circuit board

Author

Blackmore, Byron

Author_Institution

Mentor Graphics Corp., Dartmouth, MA

fYear

2009

fDate

15-19 March 2009

Firstpage

76

Lastpage

86

Abstract

Thermal conduction into a printed circuit board is often an important part of the critical heat transfer path in electronic devices. Capturing the effect of the heterogeneous and anisotropic nature of the printed circuit board´s copper distribution on thermal resistance distribution is crucial for simulations of conduction dominated cooling solutions..

Keywords

computational fluid dynamics; electronic engineering computing; finite volume methods; image processing; printed circuits; thermal conductivity; black image; black pixel distribution; critical heat transfer path; finite volume computational fluid dynamics; image processing; orthotropic material; printed circuit board; sensitivity analysis; tessellation resolution; thermal conduction; thermal conductivity; thermal resistance distribution; tiled array; white image; white pixel distribution; Anisotropic magnetoresistance; Circuit simulation; Copper; Electronics cooling; Heat transfer; Image processing; Printed circuits; Sensitivity analysis; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE

Conference_Location

San Jose, CA

ISSN

1065-2221

Print_ISBN

978-1-4244-3664-4

Electronic_ISBN

1065-2221

Type

conf

DOI

10.1109/STHERM.2009.4810746

Filename

4810746