• DocumentCode
    3101813
  • Title

    Detailed thermal modeling of high powered LEDs

  • Author

    Scheepers, G. ; Visser, J.A.

  • Author_Institution
    Dept. of Mech. Eng., North-West Univ., Potchefstroom
  • fYear
    2009
  • fDate
    15-19 March 2009
  • Firstpage
    87
  • Lastpage
    91
  • Abstract
    The introduction of high powered LEDs has brought extensive challenges with regard to thermal design, from chip level to system level thermal management. With the increased efficiency of modern high power LEDs, it is important that the thermal modeling of an LED application calculate the actual thermal load produced by the component. In the case of high power LEDs; this will differ significantly from the total power consumed. In the following paper the advantage of implementing a detailed and computationally efficient LED model is assessed. The assessment compares the detailed model with thermal resistance models and considers its ability to model transient applications as well as an optimization tool.
  • Keywords
    LED lamps; lighting; thermal management (packaging); high power LED; light emitting diodes; solid state lighting; thermal management; thermal modeling; Assembly; LED lamps; Light emitting diodes; Numerical models; Power system modeling; Temperature; Thermal loading; Thermal management; Thermal resistance; Voltage; High powered LEDs; mathematical optimization; system CFD; transient modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-3664-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2009.4810747
  • Filename
    4810747