DocumentCode :
3101904
Title :
Confirmation of a predictive process dependent model of oxide charging
Author :
Conley, J.F., Jr.
Author_Institution :
Dynamics Res. Corp., Beaverton, OR, USA
fYear :
1997
fDate :
13-16 Oct 1997
Firstpage :
138
Lastpage :
139
Abstract :
Summary form only given. The concept of building in reliability (BIR) has been gaining attention in the semiconductor industry. Full realization of BIR, in our view, requires the development of physics-based models of the effects of process parameter variations on reliability mechanisms and subsequent incorporation of these models into predictive semiconductor TCAD tools. Previously, a physics-based model of charge trapping in “intrinsic” SiO2 was introduced (Conley et al, IEEE Integrated Reliability Workshop Final Report, p. 134-141, 1996) and its potential predictive power demonstrated on a limited array of oxides (by “intrinsic”, it is meant that trapping due to extrinsic contaminants is insignificant). Here, work is presented that confirms the validity of the model´s parameters and shows that the model is predictive for a variety of oxides. In addition, very preliminary results are presented that address the equilibrium kinetics assumptions that were made in order to calibrate this model
Keywords :
circuit CAD; dielectric thin films; electron traps; hole traps; integrated circuit design; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; Si; SiO2-Si; built-in reliability; charge trapping model; equilibrium kinetics; extrinsic contaminant trapping; intrinsic SiO2; model calibration; model validation; oxide charging; physics-based models; predictive process dependent model; predictive semiconductor TCAD tools; process parameter variation effects; reliability mechanisms; semiconductor industry; Annealing; Density measurement; Electronics industry; Kinetic theory; Oxidation; Paramagnetic resonance; Predictive models; Semiconductor device reliability; Temperature; Thermodynamics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location :
Lake Tahoe, CA
Print_ISBN :
0-7803-4205-4
Type :
conf
DOI :
10.1109/IRWS.1997.660309
Filename :
660309
Link To Document :
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