• DocumentCode
    3101904
  • Title

    Confirmation of a predictive process dependent model of oxide charging

  • Author

    Conley, J.F., Jr.

  • Author_Institution
    Dynamics Res. Corp., Beaverton, OR, USA
  • fYear
    1997
  • fDate
    13-16 Oct 1997
  • Firstpage
    138
  • Lastpage
    139
  • Abstract
    Summary form only given. The concept of building in reliability (BIR) has been gaining attention in the semiconductor industry. Full realization of BIR, in our view, requires the development of physics-based models of the effects of process parameter variations on reliability mechanisms and subsequent incorporation of these models into predictive semiconductor TCAD tools. Previously, a physics-based model of charge trapping in “intrinsic” SiO2 was introduced (Conley et al, IEEE Integrated Reliability Workshop Final Report, p. 134-141, 1996) and its potential predictive power demonstrated on a limited array of oxides (by “intrinsic”, it is meant that trapping due to extrinsic contaminants is insignificant). Here, work is presented that confirms the validity of the model´s parameters and shows that the model is predictive for a variety of oxides. In addition, very preliminary results are presented that address the equilibrium kinetics assumptions that were made in order to calibrate this model
  • Keywords
    circuit CAD; dielectric thin films; electron traps; hole traps; integrated circuit design; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; Si; SiO2-Si; built-in reliability; charge trapping model; equilibrium kinetics; extrinsic contaminant trapping; intrinsic SiO2; model calibration; model validation; oxide charging; physics-based models; predictive process dependent model; predictive semiconductor TCAD tools; process parameter variation effects; reliability mechanisms; semiconductor industry; Annealing; Density measurement; Electronics industry; Kinetic theory; Oxidation; Paramagnetic resonance; Predictive models; Semiconductor device reliability; Temperature; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1997 IEEE International
  • Conference_Location
    Lake Tahoe, CA
  • Print_ISBN
    0-7803-4205-4
  • Type

    conf

  • DOI
    10.1109/IRWS.1997.660309
  • Filename
    660309