Experimental techniques for thermo-mechanical design in silicon validation platforms

Validation platforms are used to validate processors/chipsets to ensure Intel providing world-class quality and reliable products. In this paper, experimental methodologies of thermal, mechanical, acoustics, shock and vibration and ergonomic tests are demonstrated. These tests are essential to enable the boot-out-of-the-box model with increased complexities of the platforms while meeting the budget and schedule. Component level thermal testing data are correlated with CFD simulations to provide guidance for system simulations. The choice of second level thermal interface material (TIM2) was implemented using the detailed thermo-mechanical test data. Next, the acoustic tests are performed to meet acoustic safety requirements and to implement fan control to minimize system noise. Structural tests validated the retention designs based on finite element (FE) analyses. The packaged system level shock and vibration tests demonstrated the ability of the packaged system to avoid damages during shipping. Ergonomic chassis lifting tests illustrated in this paper assist to meet safety and ergonomic requirements for validation platforms. The experimental results guide the thermo-mechanical design decisions for validation platforms during the development and deployment phases. The work presented in this paper will serve as a guideline to support future thermo-mechanical designs of validation platforms.