• DocumentCode
    3102274
  • Title

    Sub-atmospheric pressure pool boiling of water on a screen-laminate enhanced surface

  • Author

    Sloan, Alison ; Penley, Sean ; Wirtz, R.A.

  • Author_Institution
    Dept. of Mech. Eng./MS 312, Univ. of Nevada Reno, Reno, NV
  • fYear
    2009
  • fDate
    15-19 March 2009
  • Firstpage
    246
  • Lastpage
    253
  • Abstract
    Saturated pool-boiling experiments at one atmosphere and sub-atmospheric pressure assess the utility of fine filament screen-laminate enhanced surfaces as effective bubble nucleation sites and bubble generators. Experiments were conducted on vertically oriented 4 cm2 copper test surfaces in saturated distilled water at pressures of 0.2 atm., 0.3 atm., 0.5 atm., and 1 atm. Boiling performance characteristics are documented. It is found that boiling performance can be significantly improved by application of a multiple layer fine filament screen laminate to the heat transfer surface. In the present work, enhancement of up to 22 times that of the unenhanced surface was obtained at a superheat of 8 K and a pressure of 0.2 atm.
  • Keywords
    boiling; bubbles; copper; heat transfer; laminates; thermal management (packaging); Cu; bubble generators; bubble nucleation sites; copper test surfaces; fine filament screen-laminate enhanced surfaces; heat transfer surface; multiple layer fine filament screen laminate; pressure 0.2 atm; pressure 0.3 atm; pressure 0.5 atm; pressure 1 atm; saturated distilled water; subatmospheric pressure pool water boiling; superheating; thermal energy management; Copper; Heat transfer; Laminates; Lamination; Power system management; Sensor arrays; Surface morphology; Thermal management; Thermal management of electronics; Wire; Pool boiling; reduced pressure; screen laminate; sub-atmospheric pressure; surface enhancement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
  • Conference_Location
    San Jose, CA
  • ISSN
    1065-2221
  • Print_ISBN
    978-1-4244-3664-4
  • Electronic_ISBN
    1065-2221
  • Type

    conf

  • DOI
    10.1109/STHERM.2009.4810771
  • Filename
    4810771