DocumentCode
3102451
Title
Performance characterization of pressure sensitive adhesive thermal interface materials
Author
Chu, Herman ; Selvakumar, Anusha
Author_Institution
Cisco Syst., Inc., San Jose, CA
fYear
2009
fDate
15-19 March 2009
Firstpage
299
Lastpage
303
Abstract
An issue often raised by engineers regarding thermal interface materials (TIM) is that vendor data do not match the results obtained from actual applications. Typical reasons for these issues may be vendor variations in testing, such as variances in test procedure and setup. This study compares vendor data from various vendors with results obtained from both realistic and ideal test conditions under consistent test method and uniform test conditions, in order to eliminate any inconsistencies in testing. This current work examines the performance of thermal pressure sensitive adhesive (PSA) TIMs, and compares the thermal performance of various materials from several vendors. For comparison to vendor data, testing is performed for flat and non-flat surfaces to examine the differences under ideal condition to that of more realistic in actual applications. The test process, results and observations are discussed.
Keywords
adhesives; thermal management (packaging); consistent test method; nonflat surfaces; thermal interface materials; thermal pressure sensitive adhesive; uniform test conditions; vendor data; Conducting materials; Cooling; Data engineering; Equations; Heat sinks; Heat transfer; Testing; Thermal conductivity; Thermal engineering; Thermal loading; PSA; Pressure sensitive adhesive; TIM; thermal interface material;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE
Conference_Location
San Jose, CA
ISSN
1065-2221
Print_ISBN
978-1-4244-3664-4
Electronic_ISBN
1065-2221
Type
conf
DOI
10.1109/STHERM.2009.4810779
Filename
4810779
Link To Document