Abstract :
The following topics are dealt with: TSV scaling and 3D FPGA; multicore and embedded SoC design; advanced techniques on routing; TSV-based 3D IC; and power network resource estimation and design.
Keywords :
field programmable gate arrays; integrated circuit interconnections; network routing; system-on-chip; three-dimensional integrated circuits; 3D FPGA; TSV scaling; TSV-based 3D IC; embedded SoC design; power network resource design; power network resource estimation; routing;
Conference_Titel :
System Level Interconnect Prediction (SLIP), 2011 13th International Workshop on
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4577-1240-1
DOI :
10.1109/SLIP.2011.6135438
