DocumentCode :
310321
Title :
Potential ceramics processing applications with high-energy electron beams
Author :
Struve, K.W. ; Turman, B.N.
Author_Institution :
Mission Res. Corp., Albuquerque, NM, USA
fYear :
1993
fDate :
7-9 June 1993
Firstpage :
117
Abstract :
Summary form only given. At a recent workshop organized to explore opportunities for electron beam processing of ceramics, several applications were identified for further development. These were ceramic joining, fabrication of ceramic powders, and surface processing of ceramics. It may be possible to join ceramics by either electron-beam brazing or welding. Brazing with refractory metals might also be feasible. The primary concern for brazing is whether the braze material can wet to the ceramic when rapidly heated by an electron beam. Raw ceramic powders, such as silicon nitride and aluminum nitride, which are difficult to produce by conventional techniques, could possibly be produced by vaporizing metals in a nitrogen atmosphere. Experiments need to be done to verify that the vaporized metal can fully react with the nitrogen. By adjusting beam parameters, high-energy beams can be used to remove surface flaws which are often sites of fracture initiation. They can also be used for surface cleaning. The advantage of electron beams over ion beams for this application is that the heat deposition can be graded into the material.
Keywords :
ceramics; aluminum nitride; beam parameters; braze material; ceramic joining; ceramic powders; ceramics processing; electron beam heating; electron beam processing; electron-beam brazing; fracture initiation; heat deposition; high-energy beams; high-energy electron beams; metal vapourisation; nitrogen atmosphere; raw ceramic powers; refractory metals; silicon nitride; surface cleaning; surface flaws; welding; Aluminum nitride; Ceramics; Electron beams; Fabrication; Nitrogen; Powders; Silicon; Surface cleaning; Surface cracks; Welding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1993. IEEE Conference Record - Abstracts., 1993 IEEE International Conference on
Conference_Location :
Vancouver, BC, Canada
ISSN :
0730-9244
Print_ISBN :
0-7803-1360-7
Type :
conf
DOI :
10.1109/PLASMA.1993.593163
Filename :
593163
Link To Document :
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