Title :
Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)
Abstract :
The following topics are dealt with: electronic product reliability; product liability; PCB reliability; semiconductor device reliability; solder joint reliability; accelerated testing; wire bonding; inspection; IC packaging reliability; aerospace equipment reliability; smart cards; adhesives; optoelectronics; stress cracking; SMT; flip-chip devices.
Keywords :
adhesive bonding; adhesives; aerospace instrumentation; circuit reliability; flip-chip devices; inspection; integrated circuit packaging; lead bonding; life testing; optoelectronic devices; printed circuits; semiconductor device reliability; smart cards; soldering; solders; surface mount technology; thermal stress cracking; IC packaging reliability; PCB reliability; SMT; accelerated testing; adhesives; aerospace equipment reliability; electronic product reliability; flip-chip devices; inspection; optoelectronics; product liability; semiconductor device reliability; smart cards; solder joint reliability; stress cracking; wire bonding;
Conference_Titel :
Business of Electronic Product Reliability and Liability, 2004 International Conference on
Conference_Location :
Shanghai, China
Print_ISBN :
0-7803-8361-3
DOI :
10.1109/BEPRL.2004.1308138
