DocumentCode
3107703
Title
Green molding compounds for high temperature automotive applications
Author
Gallo, Anthony A.
Author_Institution
Henkel Technol., Olean, NY, USA
fYear
2004
fDate
Apr 27-30, 2004
Firstpage
57
Lastpage
61
Abstract
The high temperature reliability of automotive power devices, using Au wires, seems to be strongly dependent on the rate of degradation of the Au/Al wire bond interface. Although other types of wires are available (e.g. Al and Cu), Au wires appear to be preferred for the near future. Resistance measurements show that the choice of the proper molding compound is essential in achieving good high temperature results. Green molding compounds based on transition metal oxides as flame retardants have shown the best results. The goal of 20,000 hrs at 200°C and high current seems to be achievable through the combination of the use of the green molding compound (transition metal oxides) and the metallic barrier pad design.
Keywords
aluminium; automotive electronics; electronics packaging; flame retardants; gold; high-temperature electronics; moulding; plastic packaging; reliability; transition metal compounds; 200 degC; 20000 hour; Al; Au; automotive power devices; gold wire/aluminium bonding pad interface; green molding compounds; high temperature automotive applications; high temperature reliability; interface resistance; plastic packages; transition metal oxide flame retardants; wire bond interface degradation; Automotive applications; Automotive engineering; Bonding; Copper; Degradation; Flame retardants; Gold; Plastics; Temperature; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Business of Electronic Product Reliability and Liability, 2004 International Conference on
Print_ISBN
0-7803-8361-3
Type
conf
DOI
10.1109/BEPRL.2004.1308150
Filename
1308150
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