Self-tuning regulator control scheme in wire bonding process for reliability

The factors resulting in the failure of wire bonding include, wire material, the dimension of the substrate pad, capillary effects, temperature etc, but from the viewpoint of the bonding process, there are three important parameters: bonding force, time and temperature that affect the quality and reliability of bonding. The main reason for bonding failure is that there is no high performance control scheme that regulates and tracks bonding, with optimized parameters, in the bonding process, especially pressure and time. In this paper, the main aim is to study a high performance control scheme that can regulate and track the bonding parameters well, in order to eliminate unstable factors affecting the bonding quality and improve the bonding reliability in the bonding process.