Analysis of dynamic behavior of solder reflow by solder ball test

Author

Bing, An ; Zonglin, Zheng ; Fengshun, Wu ; Jun, Lu ; Xiaodong, Zhang ; Yiping, Wu

Author_Institution

State Key Lab of Plastic Forming Simulation & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China

fYear

2004

fDate

Apr 27-30, 2004

Firstpage

92

Lastpage

95

Abstract

A dynamic model for evaluating the reflow characteristics of solder pastes is developed. The model is based on a solder paste - solder ball test (IPC-TM-650 2.4.43). The process of this test can be divided into four sequent stages: solvent effusion and volatilization, solder paste pattern shrinkage, solder ball shrinkage, and stabilization. Another bubbling stage is separated alone, because it occurs erratically. All these stages are associated with defects and their possible reasons are described and discussed. It is found that the shrinking behavior and bubbling process are two key points in the reflow process. Fast and stable shrinking, and exhaustive escaping of bubbles, are helpful to reduce the reflow defects.

Keywords

assembling; bubbles; effusion; printed circuit manufacture; reflow soldering; shrinkage; solders; stability; surface mount technology; vaporisation; IPC-TM-650 2.4.43 test; SMT printed circuit board assembly; defect analysis; reflow bubbling stage; reflow characteristics; solder ball shrinkage; solder paste pattern shrinkage; solder paste/solder ball test; solder reflow dynamic behavior; solvent effusion; solvent volatilization; stabilization; Analytical models; Circuit testing; Electronic equipment testing; Electronic mail; Lead; Performance evaluation; Plastics; Semiconductor device modeling; Surface-mount technology; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Business of Electronic Product Reliability and Liability, 2004 International Conference on

Print_ISBN

0-7803-8361-3

Type

conf

DOI

10.1109/BEPRL.2004.1308156

Filename

1308156