Title :
Technology Trends And Opportunities For Giga-scale Integration
Author_Institution :
Texas Instruments Incorporated
Keywords :
Circuits; Etching; Geometry; Instruments; Physics; Plasma applications; Plasma devices; Research and development;
Conference_Titel :
Plasma Process-Induced Damage, 1997., 2nd International Symposium on
Print_ISBN :
0-9651-5771-7
DOI :
10.1109/PPID.1997.596666
