DocumentCode

310828

Title

Technology Trends And Opportunities For Giga-scale Integration

Author

Nishi, Yoshio

Author_Institution

Texas Instruments Incorporated

fYear

1997

fDate

13-14 May 1997

Firstpage

3

Lastpage

3

Keywords

Circuits; Etching; Geometry; Instruments; Physics; Plasma applications; Plasma devices; Research and development;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Process-Induced Damage, 1997., 2nd International Symposium on

Print_ISBN

0-9651-5771-7

Type

conf

DOI

10.1109/PPID.1997.596666

Filename

596666