DocumentCode

310848

Title

Soft Silicon Etch Using Microwave Downstream Plasma For Removal Of Plasma Etch Induced Damage

Author

Deshmukh, Subhash ; Nelson, Mark

Author_Institution

American Microsystems, Inc.

fYear

1997

fDate

13-14 May 1997

Firstpage

81

Lastpage

84

Keywords

Etching; Plasma applications; Plasma chemistry; Plasma devices; Plasma materials processing; Plasma properties; Plasma waves; Silicon; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Plasma Process-Induced Damage, 1997., 2nd International Symposium on

Conference_Location

Monterey, California, USA

Print_ISBN

0-9651-5771-7

Type

conf

DOI

10.1109/PPID.1997.596699

Filename

596699