• DocumentCode
    310860
  • Title

    A Complete Approach To The In-line Monitoring Of Materials Defects Introduced In Dielectric And Si By Plasma Processing

  • Author

    Nauka, K. ; Theil, J. ; Lagowski, J. ; Jastrzebski, L. ; Sawtchouk, S.

  • Author_Institution
    Hewlett-Packard Company
  • fYear
    1997
  • fDate
    13-14 May 1997
  • Firstpage
    127
  • Lastpage
    130
  • Keywords
    Corona; Dielectric materials; Monitoring; Plasma applications; Plasma devices; Plasma diagnostics; Plasma materials processing; Plasma measurements; Plasma properties; Surface discharges;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Process-Induced Damage, 1997., 2nd International Symposium on
  • Conference_Location
    Monterey, California, USA
  • Print_ISBN
    0-9651-5771-7
  • Type

    conf

  • DOI
    10.1109/PPID.1997.596716
  • Filename
    596716
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=310860