• DocumentCode
    3108864
  • Title

    High-Q applicators for microwave processes in material science

  • Author

    Kopyt, P. ; Gwarek, W.K.

  • Author_Institution
    Inst. of Radioelectron., Warsaw, Poland
  • fYear
    2010
  • fDate
    23-28 May 2010
  • Firstpage
    1048
  • Lastpage
    1051
  • Abstract
    For years the positive effect of employing microwave energy in material processing has been observed in multiple reactions, where it leads to shorter processing time in comparison to the conventional methods. However, in a large part of the reported experiments over-size, low-Q cavities and low spectrum purity magnetrons were employed as microwave power applicators and power sources respectively. This raises some doubts regarding the accuracy of described results as the equipment makes it particularly difficult to precisely control crucial parameters of such processes. The authors of this paper suggest a more systematic approach based on high-Q, single-mode microwave power applicators aimed at formulating a one-to-one relationship between the individual microwave-assisted process characteristics and the properties of the final product. An example TM010 cavity for sintering of silicon-based composites (e.g. Si-diamond) is designed and initially verified by means of coupled multiphysics thermodynamic-electromagnetic modeling.
  • Keywords
    composite materials; microwave heating; microwave materials; silicon compounds; sintering; high-Q applicators; low-Q cavity; material processing; microwave energy; silicon-based composites; single-mode microwave power applicators; sintering; thermodynamic-electromagnetic modeling; Applicators; Composite materials; Electromagnetic heating; Magnetrons; Materials processing; Materials science and technology; Microwave devices; Microwave ovens; Powders; Silicon carbide; cavity resonators; electromagnetic heating; modeling; powders; silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
  • Conference_Location
    Anaheim, CA
  • ISSN
    0149-645X
  • Print_ISBN
    978-1-4244-6056-4
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2010.5515873
  • Filename
    5515873