Title :
IEE Colloquium on Assembly and Connections in Microsystems (Ref. No.1997/004)
Abstract :
The following topics were dealt with: packaging; bonding; micro-engineering; microsensors
Keywords :
micromechanical devices; assembly; connections; microsystems;
Conference_Titel :
Assembly and Connections in Microsystems (Digest No. 1997/004), IEE Colloquium on
Conference_Location :
London
