Industrial fabrication technology for CMOS infrared sensor arrays

Author

Munch, U. ; Jaeggi, D. ; Schneeberger, K. ; Schaufelbuhl, A. ; Paul, O. ; Baltes, H. ; Jasper, J.

Author_Institution

Phys. Electron. Lab., Eidgenossische Tech. Hochschule, Zurich, Switzerland

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

205

Abstract

We report a new technology for the industrial fabrication of CMOS infrared sensor arrays on suspended membranes. Gold lines made with the bumping technology of the IC manufacturer are used to thermally separate the sensor pixels. Further, the buckling problem of CMOS dielectric membranes was solved by finding an oxynitride passivation suitable for the fabrication of low-stress membranes. Finally, the influence of bulk crystal defects on the lateral back mask underetching was studied

Keywords

CMOS integrated circuits; arrays; batch processing (industrial); buckling; etching; infrared detectors; integrated circuit manufacture; membranes; microsensors; passivation; thermal insulation; Au; Au lines; CMOS dielectric membranes; CMOS infrared sensor arrays; KOH; KOH underetch; SiON-SiO₂-Si; buckling problem; bulk crystal defects; bumping technology; industrial fabrication technology; lateral back mask underetching; low-stress membrane fabrication; oxynitride passivation; suspended membranes; thermal separation; Biomembranes; CMOS technology; Dielectrics; Fabrication; Gold; Infrared sensors; Manufacturing industries; Sensor arrays; Textile industry; Thermal sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613619

Filename

613619